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GenX 90
GenX 90
High Performance, Compact X-Ray System
  • New Industry Standard for compact high resolution component and circuit board inspection
  • 15.5” x 21” parts handling capacity
  • 4”/2” dual view Image Intensifier with HD camera
  • Large-board, high density heat sink packaging inspection capability
  • Easy to use and operate controls
  • Low maintenance
  • 2-axis X/Y manual manipulator
  • Tilt/Rotate fixture option
  • Windows 10 Pro image processor (standard) with PXi-Pro Image Analysis
  • Worldwide service and parts support
  • Frame averaging and quad view analysis
  • Wide range of image enhancement and analysis tools (specific tool sets for QFN, BGA, Flip Chip, Discrete, and Gull Wing inspection)
  • Modules for enhance measurement capability
  • Image Storage and retrieval in tiff, bmp and jpg
Control Interface
  • Integrated x-ray controls
  • Independent power and standby keys
  • Magnification, zoom and image gain adjustment settings
  • Sample tilt/rotation oblique angle (optional)
  • Manual X-Y table motion controls


Physical Dimensions
Dimensions57” (H) x 33” (W) x 44” (D)
Footprint10.0 sq. ft. (0.86 sq. m)
Weight1000 Ibs. (544 kg)
Sample load heightVariable
Safe operating temperature32° to 99° F (0 to 40°C)
Power consumption500 watts at 120 VAC
Line voltage110/230 VAC 50/60 Hz
X-Ray Source
Energy90kV, 0.150mA
Power8 Watts maximum
Focal spot size4 microns (auto adjusting w/power)
Image Detector
Detector type4”/2” (10cm/5cm) dual view X-ray image intensifier
CameraHD, 1920 x 1080 pixels with zoom lens
Video outputUSB 3.0
Video displayHigh-resolution 23” flat panel LCD color monitor
Image Performance
Max inspection area15.5” (X) x 18“ (Y) on table surface / 39.4cm (X) x 45.7cm (Y)
Max board handling15.5” x 21“ board size
Spatial resolution>40 lp/mm
BGA Inspection
BGA Inspection
QFP Solder
QFP Solder
SMT Connector
SMT Connector
QFN Inspection
QFN Inspection
Counterfeit Component

PXI - Pacific X-Ray Imaging