858-385-1958 
GenX 90
High Performance, Compact X-Ray System
- New Industry Standard for compact high resolution component and circuit board inspection
- 15.5” x 21” parts handling capacity
- 4”/2” dual view Image Intensifier with HD camera
- Large-board, high density heat sink packaging inspection capability
- Easy to use and operate controls
- Low maintenance
- 2-axis X/Y manual manipulator
- Tilt/Rotate fixture option
- Windows 10 Pro image processor (standard) with PXi-Pro Image Analysis
- Worldwide service and parts support
Display/Analysis
- Frame averaging and quad view analysis
- Wide range of image enhancement and analysis tools (specific tool sets for QFN, BGA, Flip Chip, Discrete, and Gull Wing inspection)
- Modules for enhance measurement capability
- Image Storage and retrieval in tiff, bmp and jpg
Control Interface
- Integrated x-ray controls
- Independent power and standby keys
- Magnification, zoom and image gain adjustment settings
- Sample tilt/rotation oblique angle (optional)
- Manual X-Y table motion controls
Specifications
| Dimensions | 57” (H) x 33” (W) x 44” (D) |
| Footprint | 10.0 sq. ft. (0.86 sq. m) |
| Weight | 1000 Ibs. (544 kg) |
| Sample load height | Variable |
| Safe operating temperature | 32° to 99° F (0 to 40°C) |
| Power consumption | 500 watts at 120 VAC |
| Line voltage | 110/230 VAC 50/60 Hz |
| Energy | 90kV, 0.150mA |
| Power | 8 Watts maximum |
| Focal spot size | 4 microns (auto adjusting w/power) |
| Detector type | 4”/2” (10cm/5cm) dual view X-ray image intensifier |
| Camera | HD, 1920 x 1080 pixels with zoom lens |
| Video output | USB 3.0 |
| Video display | High-resolution 23” flat panel LCD color monitor |
| Field-of-view | Variable |
| Max inspection area | 15.5” (X) x 18“ (Y) on table surface / 39.4cm (X) x 45.7cm (Y) |
| Max board handling | 15.5” x 21“ board size |
| Spatial resolution | >40 lp/mm |
| Magnification | >1100X |
BGA Inspection
PCB X-Ray
QFP Solder
SMT Connector
QFN Inspection
Counterfeit
