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BGA Inspection

BGA ball grid array voids misshapen 3d image

This is an angled view of BGA solder ball joints with voids. The tear dropped shape of the solder joint is caused by the reflowed solder wicking out from the pads to the trace on the PCB.

BGA discretes

Off axis / compound angle capability with the Gen-X Series Systems can check for proper solder ball reflow by inspecting and measuring shape and size of the BGA ball joints.

BGA noneutectic ball

Sample x-ray image of non eutectic solder ball and its attachments to the bottom board pad and top component joint.

BGA ball grid array voids misshapen 3d image5

Example of oblique angle image of BGA solder ball joints showing inconsistent ball size and shape which is indicative of poor reflow. Void locations within the ball joints can also be seen.

BGA ball grid array voids misshapen

Overview of BGA solder ball joints showing excessive voiding, inconsistent size and shape which is a result of poor reflow.

PXI - Pacific X-Ray Imaging